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PROCHEK™


Category: PROCHEK™

Ridgetop Group’s ProChek is an innovative system to qualify the performance and characterize the intrinsic reliability of deep submicron nanotechnology CMOS processes for microelectronics applications. ProChek is designed to provide fast and reliable measurement of critical electrical performance parameters.

Description

Ridgetop Group’s ProChek is an innovative system to qualify the performance and characterize the intrinsic reliability of deep submicron nanotechnology CMOS processes for microelectronics applications. ProChek is designed to provide fast and reliable measurement of critical electrical performance parameters. Subtle variations in these parameters can have significant adverse impact on the yield and performance of chips manufactured with modern semiconductor processes. ProChek also accelerates the process of gathering data concerning common degradation effects. These effects limit the lifetime of chips manufactured with all process nodes and some are exacerbated as feature sizes shrink.
The main components of the ProChek system are the test coupon and the benchtop system. Together they comprise a comprehensive solution that delivers results for some of the most difficult device-level characterization tasks. The test coupon is manufactured using the target fabrication process and can contain multiple arrays of test structures to be characterized under various conditions. In addition to the test structures, the test coupon incorporates an on-chip switching matrix to access, control, and observe the behavior of these test structures as they are stressed in parallel and measured individually. Several test coupon configurations are available to meet different cost The main components of the ProChek system are the test coupon and the benchtop system. Together they comprise a comprehensive solution that delivers results for some of the most difficult device-level characterization tasks. The test coupon is manufactured using the target fabrication process and can contain multiple arrays of test struces to be characterized under various conditions. In addition to the test structures, the test coupon incorporates an on-chip switching matrix to access, contro, and observe the behavior of these test structures as they are stressed in parallel and measured individually. Several test coupon configurations are available to meet different cost and performance targets: (1) all the test coupon functionality is integrated on a single chip to maximize precision and test throughput; (2) for characterization and qualification of newer

Features & Benefits

Features:

  • ProChek targets reliability concerns of deep submicron nanotechnology CMOS processes
  • Test Coupon has small chip size, as small as 0.16 mm2
  • Fully programmable test conditions cover DC and AC stress cases
  • 32 to 1024 (or even more) devices can be tested simultaneously
  • Internal local heaters test temperatures up to 325 °C
  • Easy-to-use software GUI (Host Controller) includes data processing capabilities
 

Advantages:

  • Test Coupon is fully synthesizable for easy porting to multiple processes
  • Small Test Coupon size minimizes fabrication expenses
  • Test throughput of ProChek is much higher than in any other CMOS reliability test solutions
  • Large array of DUTs supports rapid characterization for all your critical devices
  • ProChek test system is compact, inexpensive, and easy to use
 

Benefits:

  • ProChek saves you weeks of characterization time
  • Major DSM degradation effects can be characterized with minimal resource expenditures
  • You can economically determine which process best suits your application
  • Expensive ATE systems are not needed